BZV55-C30
- Part number
- BZV55-C30
- Manufacturer
- NXP Semiconductors
- Package
- DO-213AC
- Status
- Active
- Stock
- Available / RFQ
- Price
- $3.29
- Year / date code
- 2025
View on SJ Chip · Request a quote
Product Overview
BZV55-C30 from NXP Semiconductors in DO-213AC is listed for electronic component sourcing at SJ Chip. Review technical specifications, package information, and nearby series parts below, then submit an RFQ to confirm stock, date code, and lead time.
Technical Specifications
- Part Number
- BZV55-C30
- Manufacturer
- NXP Semiconductors
- Series
- BZV55
- Package / Case
- DO-213AC
- Package Family
- TO
- Lifecycle Status
- Active
- Category
- Electronic Component
- Mounting Type
- Surface Mount (SMT)
Electrical Characteristics
- Device Class
- Electronic component — see manufacturer datasheet
- Key Ratings
- Confirm electrical limits for BZV55-C30 before design-in
- Package Constraint
- DO-213AC mechanical outline and pinout must match the PCB
- Substitution
- Nearby MPNs require engineering validation — not automatic drop-ins
Package Information
- Package
- DO-213AC
- Package Family
- TO
- Mounting
- Surface Mount (SMT)
- Outline Note
- Package marking on this page is for sourcing reference. Confirm body size, pitch, and land pattern from the manufacturer datasheet before layout.
Applications
BZV55-C30 is sourced for OEM/EMS electronic assemblies. Typical use depends on the manufacturer datasheet for NXP Semiconductors. Confirm electrical ratings, DO-213AC mechanics, and AVL notes before design-in or substitution. SJ Chip provides inventory checks and RFQ support for production and shortage fills.
Procurement notes
Confirm the full ordering code, package (DO-213AC), and quantity on RFQ. SJ Chip replies with stock, condition, and lead time. Nearby MPNs are for evaluation only.
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FAQ
Where to buy BZV55-C30?
You can request BZV55-C30 from SJ Chip via the RFQ form on this page or the site-wide RFQ. We confirm manufacturer (NXP Semiconductors), package, quantity, and lead time on the quotation.
Is BZV55-C30 available?
Listed inventory shows 80,000 pcs. Lot, date code, and shippable quantity are confirmed on RFQ — treat the listing as availability to quote, not a guaranteed cart ship.
What is the package of BZV55-C30?
The sourcing listing shows package DO-213AC. Always verify body size, pitch, and land pattern against the NXP Semiconductors datasheet before PCB layout.
What are alternatives to BZV55-C30?
Potential alternatives include BZV55-C33, BZV55-C18, BZV55-C27 and other same-series or same-package listings — all require datasheet and pinout checks. These are similar stock for evaluation, not automatic drop-in replacements.
Sourcing information
| Part Number | BZV55-C30 |
|---|---|
| Manufacturer | NXP Semiconductors |
| Package | DO-213AC |
| Description | NXP Semiconductors · BZV55-C30 · DO-213AC package · electronic component sourcing |
| Availability | Listed inventory: 80,000 pcs — confirm lot, date code, and quantity on RFQ |
| RFQ | Submit the full part number and quantity through the RFQ form |
| Lead Time | Lead time is confirmed on the quotation after RFQ. In-stock conventional lots often ship in 3–5 working days from Hong Kong; special, allocation, or obsolete lines are quoted separately. |
| Condition | Condition is stated on the quotation/PI (new, surplus, or EOL). Lots are inspected before shipment. |