XCE7K325T-1FFG900I

XILINX · BGA-900 · Active

Part number: XCE7K325T-1FFG900I
Manufacturer: XILINX
Package: BGA-900
Status: Active
Stock: Available / RFQ
Price: $258.20
Year / date code: 2025

Product Overview

XCE7K325T-1FFG900I (XILINX, BGA-900) — XCE7K325T-1FFG900I;Kintex 7 EP Family

Technical Specifications

Part Number: XCE7K325T-1FFG900I
Manufacturer: XILINX
Series: XCE7K325T
Package / Case: BGA-900
Package Family: BGA
Pin / Ball Count (from marking): 900
Lifecycle Status: Active
Category: FPGA / Programmable Logic
Mounting Type: Surface Mount (SMT)

Electrical Characteristics

Device Class: FPGA / programmable logic
Speed / Package Code: Speed grade and package letters are not interchangeable
I/O Standards: Confirm bank voltage and I/O standard in the datasheet
Configuration: Bitstream and config flash must match the exact ordering code
Package Constraint: BGA-900 BGA/QFP land pattern must match the PCB

Package Information

Package: BGA-900
Package Family: BGA
Mounting: Surface Mount (SMT)
Terminal Count (parsed): 900
Outline Note: Package marking on this page is for sourcing reference. Confirm body size, pitch, and land pattern from the manufacturer datasheet before layout.

Applications

XCE7K325T-1FFG900I is used in high-speed I/O, industrial gateways, vision, and custom digital logic. Speed grade, package (BGA-900), and configuration memory are BOM-critical. Do not treat another density or package letter as interchangeable without bitstream and board checks.

Procurement notes

Confirm the full ordering code, package (BGA-900), and quantity on RFQ. SJ Chip replies with stock, condition, and lead time. Nearby MPNs are for evaluation only.

Compare Similar Parts (XCE7K325T)

XCE7K325T-1FFG676C · BGA-676
XCE7K325T-1FBG676C · BGA-676
XCE7K325T-1FBV900I · FBGA-900
XCE7K325T-1FBG900I · BGA-900
XCE7K325T-1FBG676I · BGA-676
XCE7K325T-3FBG676E · BGA-676
XCE7K325T-3FFV676E · FBGA-676
XCE7K325T-3FFG676E · BGA-676
XCE7K325T-3FFV900E · FBGA-900
XCE7K325T-3FBV676E · FBGA-676
XCE7K325T-3FFG900E · BGA-900
XCE7K325T-2FFV900I · FBGA-900

Potential Alternatives (BGA-900)

FAQ

Where to buy XCE7K325T-1FFG900I?

You can request XCE7K325T-1FFG900I from SJ Chip via the RFQ form on this page or the site-wide RFQ. We confirm manufacturer (XILINX), package, quantity, and lead time on the quotation.

Is XCE7K325T-1FFG900I available?

Listed inventory shows 22,670 pcs. Lot, date code, and shippable quantity are confirmed on RFQ — treat the listing as availability to quote, not a guaranteed cart ship.

What is the package of XCE7K325T-1FFG900I?

The sourcing listing shows package BGA-900. Always verify body size, pitch, and land pattern against the XILINX datasheet before PCB layout.

What are alternatives to XCE7K325T-1FFG900I?

Potential alternatives include XCE7K325T-1FFG676C, XCE7K325T-1FBG676C, XCE7K325T-1FBV900I and other same-series or same-package listings — all require datasheet and pinout checks. These are similar stock for evaluation, not automatic drop-in replacements.

Sourcing information

Part Number	XCE7K325T-1FFG900I
Manufacturer	XILINX
Package	BGA-900
Description	XCE7K325T-1FFG900I;Kintex 7 EP Family
Availability	Listed inventory: 22,670 pcs — confirm lot, date code, and quantity on RFQ
RFQ	Submit the full part number and quantity through the RFQ form
Lead Time	Lead time is confirmed on the quotation after RFQ. In-stock conventional lots often ship in 3–5 working days from Hong Kong; special, allocation, or obsolete lines are quoted separately.
Condition	Condition is stated on the quotation/PI (new, surplus, or EOL). Lots are inspected before shipment.