XCV10004FG556C
- Part number
- XCV10004FG556C
- Manufacturer
- XILINX
- Package
- BGA-556
- Status
- Active
- Stock
- Available / RFQ
- Price
- $73.93
- Year / date code
- 2025
View on SJ Chip · Request a quote
Product Overview
XCV10004FG556C from XILINX in BGA-556 is listed for electronic component sourcing at SJ Chip. Review technical specifications, package information, and nearby series parts below, then submit an RFQ to confirm stock, date code, and lead time.
Technical Specifications
- Part Number
- XCV10004FG556C
- Manufacturer
- XILINX
- Series
- XCV10004F
- Package / Case
- BGA-556
- Package Family
- BGA
- Pin / Ball Count (from marking)
- 556
- Lifecycle Status
- Active
- Category
- FPGA / Programmable Logic
- Mounting Type
- Surface Mount (SMT)
Electrical Characteristics
- Device Class
- FPGA / programmable logic
- Speed / Package Code
- Speed grade and package letters are not interchangeable
- I/O Standards
- Confirm bank voltage and I/O standard in the datasheet
- Configuration
- Bitstream and config flash must match the exact ordering code
- Package Constraint
- BGA-556 BGA/QFP land pattern must match the PCB
Package Information
- Package
- BGA-556
- Package Family
- BGA
- Mounting
- Surface Mount (SMT)
- Terminal Count (parsed)
- 556
- Outline Note
- Package marking on this page is for sourcing reference. Confirm body size, pitch, and land pattern from the manufacturer datasheet before layout.
Applications
XCV10004FG556C is used in high-speed I/O, industrial gateways, vision, and custom digital logic. Speed grade, package (BGA-556), and configuration memory are BOM-critical. Do not treat another density or package letter as interchangeable without bitstream and board checks.
Procurement notes
Confirm the full ordering code, package (BGA-556), and quantity on RFQ. SJ Chip replies with stock, condition, and lead time. Nearby MPNs are for evaluation only.
Compare Similar Parts (XCV10004F)
- XCV10004FG256CES · BGA-256
Potential Alternatives (BGA-556)
- XCV1000FG556-4C · BGA-556
FAQ
Where to buy XCV10004FG556C?
You can request XCV10004FG556C from SJ Chip via the RFQ form on this page or the site-wide RFQ. We confirm manufacturer (XILINX), package, quantity, and lead time on the quotation.
Is XCV10004FG556C available?
Listed inventory shows 33,495 pcs. Lot, date code, and shippable quantity are confirmed on RFQ — treat the listing as availability to quote, not a guaranteed cart ship.
What is the package of XCV10004FG556C?
The sourcing listing shows package BGA-556. Always verify body size, pitch, and land pattern against the XILINX datasheet before PCB layout.
What are alternatives to XCV10004FG556C?
Potential alternatives include XCV10004FG256CES, XCV1000FG556-4C and other same-series or same-package listings — all require datasheet and pinout checks. These are similar stock for evaluation, not automatic drop-in replacements.
Sourcing information
| Part Number | XCV10004FG556C |
|---|---|
| Manufacturer | XILINX |
| Package | BGA-556 |
| Description | XILINX · XCV10004FG556C · BGA-556 package · electronic component sourcing |
| Availability | Listed inventory: 33,495 pcs — confirm lot, date code, and quantity on RFQ |
| RFQ | Submit the full part number and quantity through the RFQ form |
| Lead Time | Lead time is confirmed on the quotation after RFQ. In-stock conventional lots often ship in 3–5 working days from Hong Kong; special, allocation, or obsolete lines are quoted separately. |
| Condition | Condition is stated on the quotation/PI (new, surplus, or EOL). Lots are inspected before shipment. |