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XCV1000FG556-4C

XILINX · BGA-556 · Active

Part number
XCV1000FG556-4C
Manufacturer
XILINX
Package
BGA-556
Status
Active
Stock
Available / RFQ
Price
$74.30
Year / date code
2025

Datasheet

View on SJ Chip · Request a quote

Product Overview

XCV1000FG556-4C from XILINX in BGA-556 is listed for electronic component sourcing at SJ Chip. Review technical specifications, package information, and nearby series parts below, then submit an RFQ to confirm stock, date code, and lead time.

Technical Specifications

Part Number
XCV1000FG556-4C
Manufacturer
XILINX
Series
XCV1000F
Package / Case
BGA-556
Package Family
BGA
Pin / Ball Count (from marking)
556
Lifecycle Status
Active
Category
FPGA / Programmable Logic
Mounting Type
Surface Mount (SMT)

Electrical Characteristics

Device Class
FPGA / programmable logic
Speed / Package Code
Speed grade and package letters are not interchangeable
I/O Standards
Confirm bank voltage and I/O standard in the datasheet
Configuration
Bitstream and config flash must match the exact ordering code
Package Constraint
BGA-556 BGA/QFP land pattern must match the PCB

Package Information

Package
BGA-556
Package Family
BGA
Mounting
Surface Mount (SMT)
Terminal Count (parsed)
556
Outline Note
Package marking on this page is for sourcing reference. Confirm body size, pitch, and land pattern from the manufacturer datasheet before layout.

Applications

XCV1000FG556-4C is used in high-speed I/O, industrial gateways, vision, and custom digital logic. Speed grade, package (BGA-556), and configuration memory are BOM-critical. Do not treat another density or package letter as interchangeable without bitstream and board checks.

Procurement notes

Confirm the full ordering code, package (BGA-556), and quantity on RFQ. SJ Chip replies with stock, condition, and lead time. Nearby MPNs are for evaluation only.

Potential Alternatives (BGA-556)

FAQ

Where to buy XCV1000FG556-4C?

You can request XCV1000FG556-4C from SJ Chip via the RFQ form on this page or the site-wide RFQ. We confirm manufacturer (XILINX), package, quantity, and lead time on the quotation.

Is XCV1000FG556-4C available?

Listed inventory shows 6,499 pcs. Lot, date code, and shippable quantity are confirmed on RFQ — treat the listing as availability to quote, not a guaranteed cart ship.

What is the package of XCV1000FG556-4C?

The sourcing listing shows package BGA-556. Always verify body size, pitch, and land pattern against the XILINX datasheet before PCB layout.

What are alternatives to XCV1000FG556-4C?

Potential alternatives include XCV10004FG556C and other same-series or same-package listings — all require datasheet and pinout checks. These are similar stock for evaluation, not automatic drop-in replacements.

Sourcing information

Part NumberXCV1000FG556-4C
ManufacturerXILINX
PackageBGA-556
DescriptionXILINX · XCV1000FG556-4C · BGA-556 package · electronic component sourcing
AvailabilityListed inventory: 6,499 pcs — confirm lot, date code, and quantity on RFQ
RFQSubmit the full part number and quantity through the RFQ form
Lead TimeLead time is confirmed on the quotation after RFQ. In-stock conventional lots often ship in 3–5 working days from Hong Kong; special, allocation, or obsolete lines are quoted separately.
ConditionCondition is stated on the quotation/PI (new, surplus, or EOL). Lots are inspected before shipment.

Requested path: /products/XILINX/XCV1000FG556-4C